Development of new materials that will increase the performance of the thermal solution of electronic equipment. Herein lies also the development of manufacturing processes of those materials and to patentall of it. To support the implementation of the new materials into Huawei products , products that are aimed at high volume production. To collect and conclude requirements for the new materials and their manufacturing process . Based on
the requirements; to define research plan s on materials & processing that will support the requirements and an increased competitiveness in Huawei future thermal solutions