Indium Corporation's NanoFoil® is a reactive multilayer foil used for bonding and joining applications. It is composed of thousands of alternating, nanoscale layers of aluminum (Al) and nickel (Ni). When activated by a small, localized energy source such as a laser, electrical spark, or heat, the foil undergoes a rapid, self-sustaining exothermic reaction. This reaction releases a significant amount of thermal energy in milliseconds, melting an adjacent solder layer to create a strong, uniform bond between two components without heating the entire assembly. This technology is ideal for joining heat-sensitive components or for applications in thermally challenging environments where traditional soldering methods like reflow ovens are not feasible.