Scanning Acoustic Microscopy, X-ray inspection, Dual Beam FIB cross-sectioning, Conventional cross sectioning i.c.w. Optical or Electron Microscopy, Scanning Electron Microscopy with EDX, Decapsulation of Integrated Circuits, FIB chip modification / probe pad deposition, OBIRCH fault localization, Photon Emission (PEM) fault localization, TEM analysis