By Loadpoint
The AV-50 semi-automatic UV irradiation system is designed for UV-curable dicing tape attached to film frames used with 150 mm, 200 mm, and 300 mm wafers. It provides consistent and uniform UV exposure to ensure optimal tape curing performance, improving wafer handling efficiency and tape release characteristics during the dicing process. Specification Wafer Capacity 150mm / 200mm / 300mm Film Frames 6, 8 & 12" Throughput 60pcs/hr to 70pcs/hr Wave Length 352nm - 400nm Light Intensity>12mW/cm² Power Supply AC220V50 Hz Weight 32Kg Dimensions 550 x 550 x 180mm Features Compact Tabletop Design: Space-saving unit ideal for laboratories and production areas with limited workspace. User-Friendly Control Panel: Digital interface with real-time monitoring, UV lamp life display, and fault indication for easy operation. Comprehensive Safety System: Includes a safety interlock switch, system fuse, and fully enclosed cover to prevent UV leakage and protect the operator. Efficient UV Curing Performance: 365nm lamps effectively reduce adhesive strength on UV sensitive dicing tape enhancing die yield Consistent and Reliable Results: Provides uniform UV exposure without heat build up, preventing tape damage or over-curing. Versatile Substrate Capability: Suitable for silicon, BGA, ceramic, glass, PC board, and piezoelectric materials (200 mm or 300 mm). Low Maintenance Design: Simple, durable construction with separated UV chamber and electronics for reliability and easy upkeep.
MacroAce Pro for heavier duty applications requiring high power spindle delivery and large work areas. The MacroAce Pro offers a unique combination of dicing machine performance with CNC-like power and work area capability. The spindle's drive profile has been optimised to give maximum 3KW power delivery in the 1,000 – 10,000rpm range, exactly where it is required for heavier duty ceramic and metal cutting applications. Additionally, cut depths of up to 55mm with cut lengths of up to 450mm help make the MacroAce II a best-in-class leader. The MacroAce Pro is frequently the first-choice system for cutting bulk ceramics and lower frequency PZT sonar arrays. The performance of the MacroAce Pro is underpinned by the Loadpoint NanoControl control system; a common control platform used across all machines. NanoControl can be tailored to a customer's application. This could be taking the hassle out of calculating complex cut patterns or the easy generation of 3D cutting profiles. Max. Work Capacity (X, Y, Z) Rotational Capacity, 305mm x 305mm x 55mm Blade Capacity 100mm - 200mm (55mm cut depth with 200mm dia. blade) Chuck-type Ceramic or metal vacuum, mechanical vice, magnetic vice Spindle Options 3kW, 1,000 – 10,000rpm Dimensions (W x D x H) 1440mm x 1400mm x 2350mm (height includes traffic light) Multi-purpose Dicing and Grinding System with 55mm Cut Depth - HEAVY DUTY CUTTING FROM A SMALL FOOTPRINT - DIVERSE WORKLOADS ARE EASILY HANDLED WITH EASY WORK-LOADING, QUICK TOOL CHANGES AND FAST PROGRAM ENTRY - HIGH POSITIONAL STABILITY, ACCURACY, CONTROL AND REPEATABILITY - TOTAL FLEXIBILITY, TOTAL CONTROL - MULTI-PURPOSE DICING AND SURFACE GRINDING SYSTEM WITH UP TO 55MM CUT DEPTH - ULTRA HIGH PRECISION CUTTING OF HARD MATERIALS - HIGH POWER SPINDLE ENABLING HIGH CUTTING SPEEDS - HIGHLY FLEXIBLE VISION ALIGNMENT AND USER INTERFACE (INCLUDING AUTOMATIC MODE) OPERATIONAL SPECIFICATION Control System Loadpoint NanoControl 2.0 Work Holding Ceramic or Metal Vacuum Chuck, mechanical vice, magnetic chuck Work Capacity (XYZ) 305 x 305 x 55mm Blade Capacity (Diameter) 100 - 200mm Spindle Power 3.0 KW @ 10,000 rpm Spindle Speed 1,000 - 10,000 rpm X Axis Cutting Range 500mm X Axis Resolution 0.1 µm X Axis Feed Rate 0.1- 300 mm/s Y Axis Index Range 0.001 - 360 mm Y Axis Resolution 0.1 µm Y Axis Index Accuracy ± 3 µm / 300mm < ± 1µm / 10mm Z Axis Index Range 0.001 - 200 mm Z Axis Resolution 0.1µm Z Axis Index Accuracy < ± 2 µm / 10mm Theta Axis Drive Direct Drive Torque motor Theta Axis Range 360°(continuous) Theta Axis Resolution 4 arc sec Camera Type Monochromatic or full Colour Camera Alignment Manual or fully automatic Camera Resolution 2 MegaPixels Camera Magnification x150 - x200 - x300 Camera Illumination Coaxial and ring with dark field Footprint (WDH) (height includes status light) 1440 x 1400 x 2350 mm SERVICE REQUIREMENTS Electricity 415/440v AC three phase 16A, 50/60Hz Air supply 5.5 Bar (80 PSI) 0.17m³/min (6 CFM) Dewpoint 5°C, Oil 0.005 PPM Water supply Blade coolant 3 - 5 Bar (43 – 73 PSI) 5 - 8 Litres/min (1.3-2.1 US gal/min) Workpiece wash 3 - 5 Bar (43 – 73 PSI) 5 - 8 Litres/min (01.3-2.1 US gal/min) Spindle coolant 3 - 5 Bar (43 – 73 PSI) 18 - 20°C Recirculating Coolant Temp 1 Litres/min (0.26 US gal/min) Vacuum supply Not required, internally generate Mist extraction Mandatory 4m³/min Drain 42 mm ID drain, free flow to waste Drain height < 600 mm (24”) from base of m/c Recommended Environment Ambient temp of 20˚C, humidity level < 40% Weight 3,000KG on 6 adjustable feet (up to 10mm) Floor Level < 6mm across m/c footprint PIPE SIZES Port Pipe Diameter Cutting Wheel Blade Coolant In 10mm Wafer Wash Water In 10mm Spindle Coolant Water In 10mm Spindle Coolant Water Out 10mm Air In 10mm Vacuum Venturi Exhaust 10mm Mist Extraction Port 100mm Drain Port 40mm Standard Package The MacroAce Pro is offered in a standard package, however, bespoke packages are available with various options to suit a particular customer application. Loadpoint Air Bearing Spindle - Very low vibration improves the cut quality and reduces chipping - DC brushless drive 4kW giving full power profile across the entire speed range 1,000 to 10,000rpm - Theta (θ) axis bearing rotary table with high resolution direct drive Vision and alignment system - Manual and automatic alignment modes: - Monocular video alignment system with pattern recognition - Automatic Pattern Recognition System (PRS) - 2 point alignment with programmable off-set for off-cut alignment - Manual and automatic (option) kerf and chipping measurement on machine - Full 17inch monitor for alignment, data entry and machine monitoring - Continuous live display of X, Y, Z and theta co-ordinates - Z autofocus set up of alignment image, with offset option for depth of cut Tooling - Standard wheel carrier with 101.6 to 200mm diameter blade capacity - Main blade coolant jet adjustable to suit all blade diameters - Work holding manufactured bespoke for application - Accelerometer based Z datum set, off-chuck height sensing system NanoControl - Windows operating system with user-friendly, spreadsheet style data entry screens - Password-controlled user access to all key machine functions and a 12 month rolling log of machine actions provide full process traceability - Fitted with remote link to enable fast remote diagnostic access Work holding There is flexibility in the work-holding options to suit any customer requirements. These include; a standard ceramic vacuum chuck or metal chuck, mechanical vice or magnetic chucks. A bespoke work-holding option can be developed alongside customers to suit their specific requirements. Z height sensing Off-chuck height sensing system ensures constant depth of cut without having to use conductive blades, providing a wider choice of blade diameters and suppliers
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The NanoAce Pro is a 12” dicing saw that finds many applications in larger area substrate cutting and dicing. The NanoAce Pro is an automatic dicing saw with vision alignment system and high resolution closed loop linear positioning encoders in all axes where high performance tolerances are required. It offers a high level of configurability that allows the machine to be optimised to suit the application. The performance of the NanoAce is underpinned by the Loadpoint NanoControl control system now fitted with a user friendly touch screen interface. NanoControl can be tailored to a customer’s application. This could involve taking the hassle out of calculating complex cut patterns or could involve easy generation of 3D cutting profiles. Max. Work Capacity (X, Y, Z) 300mm x 300mm x 13mm Blade Capacity 50.8mm – 101.6mm Chuck-type Ceramic or metal vacuum Spindle Options 1.8kW, 3,000 – 60,000rpm as standard, or 2.4kW 3,000 – 60,000rpm Dimensions (W x D x H) 1046mm x 1030mm x 2048mm (height includes traffic light) OPERATIONAL SPECIFICATION Control System Loadpoint NanoControl 2.0 Work Holding Ceramic or Metal Vacuum Chuck Work Capacity (XYZ) 300 x 300 x 13mm (Custom configurations to work area & blade capacity are achievable) Blade Capacity (Diameter) 50.8 - 101.6 Spindle Power 1.8 KW @ 60,000 rpm X Axis Cutting Range 340 mm X Axis Resolution 0.1 µm X Axis Feed Rate 0.1 - 500 mm/s Y Axis Index Range 0.001 - 360 mm Y Axis Resolution 0.1 µm Y Axis Index Accuracy ± 3 µm / 300mm < ± 1µm / 10mm Z Axis Index Range 0.001 - 200mm Z Axis Resolution 0.1µm Z Axis Index Accuracy ± 2 µm / 10mm Theta Axis Drive Direct Drive Torque motor Theta Axis Range 360°(continuous) Theta Axis Resolution 4 arc sec Camera Type Monochromatic or full Colour Camera Alignment Manual or fully automatic Camera Resolution 2 MegaPixels Camera Magnification x150 - x200 - x300 Camera Illumination Coaxial and ring (with dark field option) Footprint (WDH) (height includes status light) 1046mm x 1030mm x 2048mm SERVICE REQUIREMENTS Electricity 220/240v AC single phase 10A, 50/60Hz Air supply 5.5 Bar (80 PSI) 0.11m³/min (4 CFM) Dewpoint 5°C, Oil 0.005 PPM Water supply Blade coolant 3 - 5 Bar (43 – 73 PSI) 5 - 8 Litres/min (1.3-2.1 US gal/min) Workpiece wash 3 - 5 Bar (43 – 73 PSI) 5 - 8 Litres/min (01.3-2.1 US gal/min) Spindle coolant 3 - 5 Bar (43 – 73 PSI) 18 - 20°C Recirculating Coolant Temp 1 Litres/min (0.26 US gal/min) Vacuum supply Not required, internally generate Mist extraction Mandatory 4m³/min Drain 42 mm ID drain, free flow to waste Drain height < 600 mm (24”) from base of m/c Recommended Environment Ambient temp of 20˚C, humidity level < 40% Weight 720KG on 4 adjustable feet (up to 10mm) Floor Level < 6mm across m/c footprint PIPE SIZES Port Pipe Diameter Cutting Wheel Blade Coolant In 10mm Wafer Wash Water In 10mm Spindle Coolant Water In 10mm Spindle Coolant Water Out 10mm Air In 10mm Vacuum Venturi Exhaust 10mm Mist Extraction Port 100mm or 40mm Drain Port 40mm STANDARD PACKAGE & OPTIONS NanoControl - Windows 10 based operating software with touch screen technology - Fast program entry even for complex cutting patterns Vision & Alignment system - USB 3 camera Tooling - 50.8 – 101.6mm dicing blade capacity, coolant delivery - Various work holding options; Ceramic vacuum chuck, solid chuck, either tape ring or film frame, Loadpoint also manufacture standard and custom chucks bespoke to customer requirements. - Accelerometer based Z datum set, off-chuck height sensing system Loadpoint Air Bearing Spindle - Very low vibration improves the cut quality and reduces chipping - Spindle: 1.8kW, 3,000 – 60,000rpm, Ultra low-vibration A few features of the latest technology - Multi-language display - Option of x 2 image magnification with no loss of resolution Screen - NanoAce 3300 uses a large 470mm x 270mm touchscreen underpinned by the latest NanoControl software Operational Flexibility - Tracker ball has outer jog ring for high precision alignment of components Ease of Use User friendly NanoControl software with flexibility and ease of use at its principal core. This software is developed and updated at our headquarters to not only continually improve its flexibility and ease of use but also add feature requirements unique to a customer’s application. Materials Processed Ceramic, FR3/FR4, GaAs, Germanium, Glass, InP, LED’s, Lithium Niobate and Tantalate, QFN, Piezo electrics, PZT, Quartz, Sapphire and Silicon amongst others. This system is Windows 10 based and offers many features such as: - Kerf check - BBD - Blade Wear Compensation Dicing solutions for: SEMICONDUCTORS OPTICAL ELECTRONICS MEDICAL FERRO-ELECTRONICS SOLAR OPTO-ELECTRONICS SONAR From Prototype to Production and Everything In-between - LARGE 470MM X 270MM TOUCH SCREEN - 200MM / 12” DICING SYSTEM - TOTAL FLEXIBILITY, TOTAL CONTROL
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The NanoAce Duo Pro is a newly developed 12” semi-automatic dicing saw, equipped with two facing spindles that can simultaneously dice workpieces at high throughput, a vision alignment system and high resolution closed loop linear positioning encoders in Y axes where high performance tolerances are required. This machine has a very small footprint compared to its equivalents. It features an auto-alignment function, auto kerf check function, self-adjustment function, and statistical analysis function. A high-power spindle is also available for this machine. The performance of the NanoAce Duo Pro is underpinned by a new Loadpoint NanoControl control system, which is equipped with a user-friendly 17" LCD touchscreen and operated through an intuitive new user interface. Max. Work Capacity (X, Y, Z) 300 x 300 x 4mm（full cut） 300 x 300 x 6mm（partial cut） Blade Capacity 49mm – 60mm Chuck-type Ceramic or metal vacuum Spindle Power 1.8kW @ 60,000rpm Dimensions (W x D x H) 1280mm x 1120mm x 1880mm (height includes traffic light) Dicing solutions for: SEMICONDUCTORS, OPTICAL, ELECTRONICS, MEDICAL, FERRO-ELECTRONICS, SOLAR, OPTO-ELECTRONICS, SONAR From Prototype to Production and Everything In-between - FROM THE LATEST WAFER DESIGNS TO CERAMIC COMPONENTS AND EVERYTHING IN BETWEEN - WITH THE MAXIMUM STROKE OF 30MM IN THE Z AXIS, THE NANOACE DUO PRO HAS ALL DICING REQUIREMENTS COVERED - TOTAL FLEXIBILITY, TOTAL CONTROL OPERATIONAL SPECIFICATION Control System Loadpoint NanoControl 3.0 Work Holding Ceramic or Metal Vacuum Chuck Work Capacity (XYZ) Wafer ：12" Square：300 x 300 x 4mm（full cut） 300 x300 x 6mm（partial cut） Blade Capacity (Diameter) 49 mm - 60 mm Spindle Power 1.8 KW @ 60,000 rpm X Axis Cutting Range 310 mm X Axis Resolution 0.1 µm X Axis Feed Rate 0.01 - 1000 mm/s Y Axis Index Range 0.001 - 310 mm Y Axis Resolution 0.1 µm Y Axis Index Accuracy Within 3 µm / 310mm (Single step accuracy) with 2µm/ 5mm Z Axis Index Range 0.001 - 30mm Z Axis Resolution 0.1µm Z Axis Index Accuracy Repeated positioning accuracy: 1 µm Theta Axis Drive Direct Drive Torque motor Theta Axis Range 380°(continuous) (-60° ~ 320°) Theta Axis Resolution ± 3.0 Arc sec Camera Type Monochromatic Camera Alignment Manual or fully automatic Camera Resolution 2 MegaPixels Camera Magnification x48 - x96 - x386 Camera Illumination Coaxial and ring (with dark field option) Footprint (WDH) (height includes status light) 1280mm x 1120mm x 1880mm SERVICE REQUIREMENTS Electricity 220v AC ±10% three phase 20A, 50/60Hz; 380v AC ±10% three phase 20A, 50/60Hz Air supply 5.5 Bar 0.11m³/min (4 CFM) Water supply Blade coolant 3 - 4 Bar Cutting Water 12 L/min Workpiece wash Not required Spindle coolant 3 - 4 Bar Same as ambient room temperature 3 Litres/min Vacuum supply Not required, internally generate Mist extraction ≥5.0m³/min Drain Connecting pipe OD φ38mm Drain pipe height from ground < 550 mm Recommended Environment Ambient temp（22±2）℃，Fluctuation：±1℃ Ambient humidity：（55±15）%RH Weight 1700KG on 4 adjustable feet PIPE SIZES Port Pipe Diameter Cutting Wheel Blade Coolant In 16mm Wafer Wash Water In Not required Spindle Coolant Water In 10mm Spindle Coolant Water Out 10mm Air In 12mm Vacuum Venturi Exhaust Merges into main exhaust Mist Extraction Port 101mm Drain Port Connecting pipe OD: φ38mm Factory drainage outlet: ≥φ50mm, Max. distance from machine: ≤2m STANDARD PACKAGE Loadpoint Air Bearing Spindle - Very low vibration improves the cut quality and reduces chipping - DC brushless drive, 1.8 kW 60,000 rev per min - High power option 2.2 kW 60,000 rev per min Vision and alignment system Manual and automatic alignment modes: - Monocular video alignment system with pattern recognition - Pattern Recognition System (PRS) - Automatic alignment as standard - Automatic cutting & kerf check as standard - Full 17” touch screen monitor for alignment, data entry and machine monitoring - Continuous live display of X,Y,Z and theta co-ordinates - Z autofocus set up of alignment image with offset option Tooling - Standard wheel carrier with 60 mm diameter blade capacity - Three direction coolant delivery; main blade coolant jet, blade side wash bars and wafer flood jets - Accelerometer based Z datum set, off-chuck height sensing system Z height sensing Off-chuck height sensing system ensures constant depth of cut without having to use conductive blades, providing a wider choice of blade diameters and suppliers. Work holding Standard packages include adaptable plain wafer vacuum chuck for use with wax and substrate mounting and tape rings. Loadpoint manufacture chucks for all tape rings and film frames, mechanical vices, and designs to customer requirements, including precision-ground ceramic inserts for improved vacuum and component support. Materials Processed Ceramic, FR3/FR4, GaAs, Germanium, Glass, InP, LED’s, Lithium Niobate and Tantalate, QFN, Piezo electrics, PZT, Quartz, Sapphire and Silicon amongst others.
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The NanoAce 4220 Fully Automatic Dicng Saw is a newly developed 8"fully automatic dicing saw,equipped with dual facing spindles that can dice workpieces simultaneously at high throughput,a vision alignment system and high resolution closed loop linear positioning encoders in Y axes where high performance tolerances are required. This machine is highly cost-effective due to its rapid dicing speed and fully automated operation.It features an auto-alignment function,auto kerf check function,self-adjustment function,and statistical analysis function.A high-power spindle is also available for this machine. The performance of the NanoAce 4220 is underpinned by a new Loadpoint NanoControl control system,which is equipped with a user-friendly 17"LCD touch screen and operated through an intuitive new user interface. Max. Work Capacity (X, Y, Z)Φ8 inch Blade Capacity OD 49mm – 60mm Chuck-type Ceramic or metal vacuum Spindle Options 1.8kW, 6,000 – 60,000rpm as standard, or 2.2kW 6,000 – 60,000rpm Dimensions (W x D x H) 1375mm x 1430mm x 1950mm Dicing solutions for: SEMICONDUCTORS OPTICAL ELECTRONICS MEDICAL FERRO-ELECTRONICS SOLAR OPTO-ELECTRONICS SONAR From Prototype to Production and Everything In-between - FROM THE LATEST WAFER DESIGNS TO CERAMIC COMPONENTS AND EVERYTHING IN BETWEEN - WITH THE MAXIMUM STROKE OF 30MM IN THE Z AXIS, THE NANOACE FULLY AUTOMATIC DUO PRO HAS ALL DICING REQUIREMENTS COVERED - TOTAL FLEXIBILITY, TOTAL CONTROL OPERATIONAL SPECIFICATION Control System Loadpoint NanoControl 3.0 Work Holding Ceramic or Metal Vacuum Chuck Work Capacity (XYZ)Wafer：8" Square：140 x 140 x 4mm（full cut） 140 x 140 x 6mm（partial cut） Blade Capacity (Outer Diameter)49mm – 60mm Spindle Power 1.8 KW @ 60,000 rpm X Axis Cutting Range 210 mm X Axis Resolution 0.1 µm X Axis Feed Rate 0.01 - 1000 mm/s Y Axis Index Range 0.001 - 210 mm Y Axis Resolution 0.1 µm Y Axis Index Accuracy Within 2μm / 210 mm (Single step accuracy) with 2μm / 5 mm Z Axis Index Range 0.001 - 30mm Z Axis Resolution 0.1µm Z Axis Index Accuracy Repeated positioning accuracy: 1 μm Theta Axis Drive Direct Drive Torque motor Theta Axis Range 380°(continuous) (-60°～320°) Theta Axis Resolution±3.0 Arc sec Camera Type Monochromatic Camera Alignment Manual or fully automatic Camera Resolution 2 MegaPixels Camera Magnification x48 - x96 - x386 Camera Illumination Coaxial and ring Footprint (WDH) (height includes status light)1375mm x 1430mm x 1950mm SERVICE REQUIREMENTS Electricity- 380v AC ±10% three phase 20A, 50/60Hz Air supply 5 - 8 Bar 650 L/min Blade coolant 3 - 4 Bar Cutting Water 6 L/min Workpiece wash 3 - 4 Bar Wash water 6 L/min Spindle coolant 3 - 4 Bar Same as ambient room temperature 4L/min Vacuum supply Not required, internally generate Mist extraction≥5.0m³/min Drain Connecting pipe OD Φ 38mm Drain pipe height from ground < 550 mm Recommended Environment Ambient temp（22±2）℃ Fluctuation：±1℃ Ambient humidity：（55±15）%RH Weight 2100KG on 4 adjustable feet PIPE SIZES Port Pipe Diameter Cutting Wheel Blade Coolant In 16mm Wafer Wash Water In 12mm Spindle Coolant Water In 10mm Spindle Coolant Water Out 10mm Air In 12mm Vacuum Venturi Exhaust Merges into main exhaust Mist Extraction Port Φ 101mm Drain Port Connecting pipe OD: Φ 38mm Factory drainage outlet: ≥Φ 50mm Max. distance from machine: ≤2m STANDARD PACKAGE Loadpoint Air Bearing Spindle - Very low vibration improves the cut quality and reduces chipping - DC brushless drive, 1.8 kW 60,000 rev per min - High power option 2.2 kW 60,000 rev per min Vision & alignment system & Cleaning system - Manual and automatic alignment modes - Monocular video alignment system with pattern recognition - Automatic alignment as standard - Automatic cutting & kerf check as standard - Full 17” touch screen monitor for alignment, data entry and machine monitoring - Continuous live display of X,Y,Z and theta co-ordinates - Z autofocus set up of alignment image with offset option - Built-it automatic wafer cleaning station, wash and dry - Automatic, consistent wafer transfer system Tooling - Standard wheel carrier with 60 mm diameter blade capacity - Three direction coolant delivery; main blade coolant jet, blade side wash bars and wafer flood jets - Cleaning station with atomised cleaning features - Accelerometer based Z datum set, off-chuck height sensing system Z height sensing Off-chuck height sensing system ensures constant depth of cut without having to use conductive blades, providing a wider choice of blade diameters and suppliers. Work holding Standard packages include adaptable plain wafer vacuum chuck for use with 8'' and 6'' film frames. Materials Processed Ceramic, FR3/FR4, GaAs, Germanium, Glass, InP, LED’s, Lithium Niobate and Tantalate, QFN, Piezo electrics, PZT, Quartz, Sapphire and Silicon amongst others.
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