By AMT&C Group (Advanced Magnetic Technologies & Consulting Group)
D-shape e-beam evaporation system for batch wafer processing D-shape evaporation system provides thin film deposition of metals, including refractory metals (Ti, Al, Ni, Au, V, Mo, Cr, Ge), dielectrics and semiconductor materials in high vacuum. Technologies: e-Beam evaporation System capacity - 45×Ø2” - 21×Ø3” - 8×Ø100 mm - 5×Ø150 mm Ultimate pressure - 4x10-6 Torr Evaporator crucible volume - 4×30 cm 3/ 6×15 cm 3 E-beam digital scanning system - Available Max wafer heating - up to 300°C* Wafer holder type - Dome Antidust removable screens - Available Thickness uniformity of evaporated material on wafer Ø100 mm - ±2,5 % Key features 01 Improved thickness uniformity due to the special "mask" technology 02 Embedding in a cluster system 03 Revolver type of e-beam source Basic technologies Ni evaporation uniformity on wafer Ø100 mm
Materials: H2 Advantages: - Low energy consumption - Absence of high-energy particles and ions - Integrated water cooling Technical characteristics Thermocouple: Type C Bakeout temperature: 200°С Operating temperature: 2000°С In-vacuum length: 190-400 mm In-vacuum diameter: 36 mm Mounting flange: 40CF
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Materials: N2, H2, SiH4 ADVANTAGES: - PBN ionization chamber - Integrated matching device - Inductive plasma Technical characteristics - Input power: 50-400 W - In-vacuum length: 292 mm - Mounting flange: 63/100CF
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Counter-rotating vane set provides for linear control across the entire operating range of the valve. The precise setting of vane rotation of the plates is realized due to the servo-based flap control system.
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