By AMT&C Group (Advanced Magnetic Technologies & Consulting Group)
Magnetron sputtering system for batch wafer processing STE MS900 magnetron sputtering system ensure to sputter metal coatings (Cu, Cr, Ni, Ag, Al, Ti, W, V, Ta), dielectrics, resistive alloys, ITO films. Optimized HV evaporation chamber includes a fixed source block and a lifting top cover. System capacity - 24 pcs - 60×48 mm - 6×Ø100 mm - 6×Ø150 mm - 5×Ø200 mm Ultimate pressure - <4x10-6 Torr Magnetron source quantity - 5 with targets up to Ø150 mm - 4 with targets up to Ø200 mm Wafer holder - Flat carousel Thickness uniformity of sputtered layers on wafer Ø100 mm - ±5 % Key features 01 Double-sided sputtering due to 180° wafer holder overturn 02 Ergonomic design for convenient maintenance 03 Wide range of multicomponent coatings
Materials: H2 Advantages: - Low energy consumption - Absence of high-energy particles and ions - Integrated water cooling Technical characteristics Thermocouple: Type C Bakeout temperature: 200°С Operating temperature: 2000°С In-vacuum length: 190-400 mm In-vacuum diameter: 36 mm Mounting flange: 40CF
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Materials: N2, H2, SiH4 ADVANTAGES: - PBN ionization chamber - Integrated matching device - Inductive plasma Technical characteristics - Input power: 50-400 W - In-vacuum length: 292 mm - Mounting flange: 63/100CF
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Counter-rotating vane set provides for linear control across the entire operating range of the valve. The precise setting of vane rotation of the plates is realized due to the servo-based flap control system.
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