By AMT&C Group (Advanced Magnetic Technologies & Consulting Group)
Magnetron sources, also with a scanning magnetic field, provide sputtering of materials on wafers up to Ø200 mm. The rotation of magnetic system relative to the target provides high coating uniformity and low sputtering material consumption.
Materials: H2 Advantages: - Low energy consumption - Absence of high-energy particles and ions - Integrated water cooling Technical characteristics Thermocouple: Type C Bakeout temperature: 200°С Operating temperature: 2000°С In-vacuum length: 190-400 mm In-vacuum diameter: 36 mm Mounting flange: 40CF
CATEGORY
Materials: N2, H2, SiH4 ADVANTAGES: - PBN ionization chamber - Integrated matching device - Inductive plasma Technical characteristics - Input power: 50-400 W - In-vacuum length: 292 mm - Mounting flange: 63/100CF
CATEGORY
Counter-rotating vane set provides for linear control across the entire operating range of the valve. The precise setting of vane rotation of the plates is realized due to the servo-based flap control system.
CATEGORY
