By working with Palomar Technologies, LED manufacturers can: - Optimize device lifetime without sacrificing throughput by utilizing Palomar combo bonding (die or wire bonding combined with vacuum reflow). - Manage high volume production across a single family of bonding systems. - Utilize the broad range of capabilities of Palomar bonders to handle unique applications. Palomar Technologies knows how to solve the packaging challenges associated with high power industrial LEDs. The Palomar 3880 Die Bonder is used to tack an LED to the substrate. Once tacking is complete, the SST 5100 or SST 8300 Vacuum Reflow System uses eutectic die attach which results in a void-free attach and higher quality. Wire connections are quickly bonded from LED to substrate using the Palomar 8100 Wire Bonder.
