By Wintech Nano-Technology Services Pte. Ltd.
Ⅰ.everal failure modes of PCB: Virtual soldering; contaminate; Mechanical damage; Moist stress; crack; Burst board; Media corrosion; delamination; empty; Fatigue injury; CAF or ion migration; Stress overload. Ⅱ. PCB failure analysis uses equipment: Optical Microscope; X-ray; Infrared microscope FTIR; Slice Cross section; Thermal stress; Solder-ability; Peel strength; Stretch the tensile test; Withstand voltage Hi-pot; Insulation resistance; Conductivity Omega meter; Ionic Chromatography; X-fluorescent surface thickness XRF/thickness; Dye & pry; SEM/EDX spectroscopy of SEM/EDX; Shear/Pull test; Thermomechanical/differential scanning analysis TMA/DSC(Tg, CTE, TD, cure factor); Thermogravimetric analysis TGA(Td, moisture content); Strain measurement (Heat sink process simulation); Impedance TDR; Water drop test Water drop test; Ultrasound scan SAT; Kaifeng De-cap; Electrical test LCR. Ⅲ. PCB failure analysis technology: X-ray (X-ray); 3D X-ray (CT X-ray); TDR (Time Domain Reflectometer); Slice analysis; Ion section analysis; PCB slicing; Scanning acoustic microscope SAT; Infrared microscope Micro-FTIR; Scanning electron microscopy (SEM); Scanning electron microscopy and spectroscopy analysis SEM-EDX; Photoelectron spectroscopy (XPS/ESCA); Differential scanning calorimetry analysis DSC; Thermomechanical Analysis TMA; Thermogravimetric analysis TGA; Solder joint analysis; Solder joint mechanical test; Thermal stress; Solderability testing Solderability; Tensile testing Tensile; Surface topography analysis
