Using the Solstice® Wet Etch Chamber Patterned metal etching is used for under-bump metallization (UBM) in wafer-level packaging applications, as well as feature isolation following plating and photoresist strip processing. Key considerations for UBM and metal wet etch are cross-wafer uniformity, repeatability, undercut or critical dimension (CD) loss, cost-of-ownership and throughput. The Solstice platform offers world-class cross-wafer uniformity due to its flood flow spray and precision rpm control. End-point detection is standard for patterned metal etch applications to ensure minimal possible undercut and CD loss. Our wet etch processing technology delivers industry-leading plating rates and uniformity to ensure optimal precision, control and performance. Applications - Wafer-level packaging - Flip chip Features - High flexibility - Cross-wafer uniformity - Run-to-run repeatability Benefits - Low cost of ownership - High flexibility - Process effectiveness Completed gold and titanium etch with zero undercut, processed by Solstice.
