Advancements in Power Electronics & Automotive Microelectronics Packaging Palomar Technologies works with research institutes around the world to contribute to the development and advancement of techniques and technologies key to microelectronics packaging for semiconductor industry. Our work with these institutes results in new processes, new products, or new applications for our customers. Palomar Technologies subsidiary, SST Vacuum Reflow Systems is working closely with the Fraunhofer Institute for Integrated Systems and Device Technology IISB in the area of high-quality, void-free power module packaging for electric vehicles. The Fraunhofer Institute for Integrated Systems and Device Technology IISB conducts applied research and development in the field of electronic systems for application in, e.g., electric mobility, aerospace, Industry 4.0, power grids or energy technology. In this connection, the institute uniquely covers the entire value chain – from basic materials to whole power electronic systems. As part of the cooperation, Palomar has placed a SST 8301 Automated Vacuum Soldering System within the Fraunhofer Institute. It will be available for demonstrations, prototypes, and research projects focusing on key components inside power electronics, dies to DBC, connectors/pins to DBC and DBC to base plate soldering. To learn more about how you can work with SST and Fraunhofer IISB utilizing the SST 8301, please contact: Thorsten Scheidler, Managing Director, Palomar Technologies GmbH Am Weichselgarten 30b │ 91058 Erlangen, Germany Mobile: +49 151 18156815
