By Wintech Nano-Technology Services Pte. Ltd.
Through ultrasonic penetration of plastic packaging and ceramic package, used to detect defects such as layered delamination or hole void inside the sample, probes of different frequencies have different penetration depths, and different interfaces can be scanned by controlling the focusing depth of ultrasonic waves, and with the two working modes of reflective C-SAM and penetrating Through Scan. (1) Equipment parameters 10MHz-300 MHz in a variety of sizes Scan modes: A-Scan, B-Scan, C-Scan, Q-Scan, T-Scan Supporting grayscale recognition and pixel calculation software: DIA software (2) Non-destructive testing, which can quickly detect internal delamination, cavities, cracks and other defects.
