By SAMCO Inc.
Samco offers reliable and durable Reactive Ion Etching (RIE) systems for R&D and production customers. Our benchtop compact RIE etcher is a suitable tool for academic device research and die deprocessing for IC failure analysis. Samco’s open load RIE systems and load lock RIE systems have a wide process window for plasma etching of various materials (silicon, dielectrics, compound semiconductors, metals, polymers and photoresist). The cassette loading RIE systems improve process throughput for device fabrication. Key Features & Benefits - Highly selective anisotropic etching meets demanding process requirements - A symmetrical evacuation design improves etching uniformity - Fully automatic “one-button” operation with full manual override - A computerized touch screen provides a user-friendly interface for parameter control and storage - Automatic pressure control that allows for precise control of process pressure independent of gas flow - Dry pump and system layout allow for ease of maintenance - 13.56 MHz RF generator with automatic matching delivers excellent process repeatability - Sleek, compact designs require minimal cleanroom space Applications - Etching of various materials such as Si, SiO2, SiN, Poly-Si, GaAs, Mo, Pt, Polyimide, etc. - Removal of various types of passivation films - Selective layer etching in failure analysis - Photoresist ashing, stripping, and descuming - Surface modification (wettability and adhesion improvement) - Surface treatment of glass substrates, etc. - Removal of organic contaminants
