By COMSOL, Inc.
The COMSOL Multiphysics® software and the Heat Transfer Module add-on are widely used for thermal analysis in devices and processes. Their simulation capabilities enable users to combine all three modes of heat transfer — conduction, convection, and radiation — and calculate temperature fields and heat fluxes in everything from small-scale components to larger assemblies and built environments. COMSOL Multiphysics® is designed to capture how thermal effects interact with other physics through multiphysics coupling, enabling realistic studies of conjugate heat transfer and nonisothermal flow; heat generation from various sources, including electromagnetic and chemical effects; and temperature-dependent material behavior. This session will provide an overview of the functionality in COMSOL Multiphysics® that supports the design, optimization, and validation of thermal management solutions.
