NW
Failure Analysis & DiagnosticsCharacterization & Testing

Physical Failure analysis

By Wintech Nano-Technology Services Pte. Ltd.

Although semiconductor chips are small, their internal structure is very complex, especially the thousands of transistors in the microscopic unit at its core. Analysis Technique Lateral Resolution STEM scanning transmission electron microscopy 0.19nm TEM transmission electron microscopy 0.24nm SEM SE SE Scanning EM Secondary Electronics 0.6nm TEM-EDX lens energy spectrum 1nm SEM BSE scanning electron microscopy backscattering 1.8nm FIB focused ion beam 4nm Auger Electronics 8nm Laser microscopy>250nm Optical Microscopy>300nm SEM-EDX scanning electron microscopy energy spectrum>300nm 3D Nano-CT high-resolution tomography 0.9um X-Ray 1um Stereo Microscopy asana microscopy>1um