By SAMCO Inc.
Smooth sidewalls A 2 mm wide large-area etching process was performed using the Bosch Process, achieving: - Etch depth: 300 μm - Etch selectivity: 170 (over photoresist) - Open area: <10% The etched profile demonstrated smooth sidewalls and a flat bottom, free from grass-like structures or pits. This process is ideal for fabricating piezoelectric MEMS sensors, such as those requiring large-area air gaps to release piezoelectric membranes or cantilevers.
