NW
Lithography & NanopatterningFabrication & Surface Engineering

Spin coating and wafer development

By Melbourne Centre for Nanofabrication

A crucial element in any lithographic process, coating wafers with photoresist and subsequently developing them, allows for the mold features to be faithfully replicated on the wafers. MCN has both manual and automatic spin coaters, the latter offering users options for both high throughput and single wafer runs while utilising a fully automated and precise robotic system. The Pico Track PCT-150RRE is capable of running wafer sizes of 4 inch and 6 inch diameter with no change-over requirements. Comprised of numerous spin modules, the system can adapt to virtually all photolithography processes with precision and produce patterned wafers with extremely high uniformity. The track system automates all steps continuously including adhesion promoter, pre-baking, resist coating, edge-bead removal (EBR), development, and post-baking. In addition to the Pico Track, MCN has a stand-alone automated developer system for enhanced photolithography processing. Capable of running 2 inch to 6 inch wafer sizes, this new developer system can be used by itself, or in-conjunction with the Pico Track to provide more resist development options.