By Wintech Nano-Technology Services Pte. Ltd.
Semiconductor device failure analysis is to determine the form of device failure (failure mode), analyze the physical and chemical processes (failure mechanism) that cause device failure (failure mechanism), find the cause of device failure, and formulate corrective and improvement measures through various tests and physical, chemical and metallographic tests on failed devices. The general procedures of failure analysis include: collecting failure site data, electrical measurement to determine failure modes, scheme design, non-destructive analysis, opening the package, microscopic inspection, energizing the excitation chip, failure location, physical and chemical analysis of the failure site, comprehensive analysis to determine the cause of failure, and propose corrective measures. The function of failure analysis is to locate the failure point for abnormal chips (signal detection errors), and judge the mechanism of chip failure based on the original design of the chip. Failure analysis requires comprehensive knowledge, including electronics, processes, structures, materials, physicochemistry and many other aspects.
