By EKSPLA
SSAIL (Selective Surface Activation Induced by Laser) is a technology developed by the Center for Physical Sciences and Technology (FTMC) and Akoneer for writing electronic circuits directly onto dielectric surfaces. The process runs in three steps: an ultra-short pulse laser modifies the surface along the circuit pattern, the modified areas are chemically activated, and electroless plating then deposits copper only where the laser has written. Trace widths go down to 1 µm, and the process works on PC/ABS, PMMA, PET, FR-4, Al 2 O 3 ceramic, fused silica, silicon and other materials.
