By Wintech Nano-Technology Services Pte. Ltd.
Project introduction DPA analyzes benefits Component manufacturers: understand product quality, improve product design process, and reduce business risks System Integrator: Enhance procurement quality monitoring, eliminate early hazards, and improve product reliability DPA’s main analysis items: 1. Visual Inspection 2. X-ray inspection 3. Ultrasound examination C–SAM 4. Open Decap/Take DIE 5. Internal Inspection 6. Slice Cross-section 7. Electron microscopy SEM/EDAX 8. Pull Test 9. Bonding strength 10. Attachment strength 11. Terminal strength 12. Airproof Check 13. Integrity Inspection Passivation 14. Sampling with Microscop 15. Physical Check 16. Particle Noise PIND 17. Contact Check 18. Shear Strength Test Shear Test DPA analysis flowchart DPA different types of package analysis process DPA is mainly analytical instruments and equipment Optical Microscope X-ray Infrared microscope FTIR Slice Cross section Solder-ability Peel strength Stretch the tensile test X-fluorescent surface thickness XRF/thickness SEM/EDX spectroscopy of SEM/EDX Shear/Pull test SEM/EDX spectroscopy of SEM/EDX Shear/Pull test Thermomechanical/differential scanning analysis TMA/DSC(Tg, CTE, TD, cure factor) Thermogravimetric analysis TGA(Td, moisture content) Strain measurement (Heat sink process simulation) Impedance TDR Ultrasound scan SAT Kaifeng De-cap Electrical test LCR The main analysis cases of DPA are as follows: The case of the Hitachi SU5000 SEM
