By TSMC (Taiwan Semiconductor Manufacturing Company)
In the fast-paced semiconductor industry, the design complexity is growing with the innovations on cutting-edge technologies. To address the increasing demands of EDA workload, TSMC collaborates with Cloud Alliance partners to develop a range of acceleration methodologies aiming to optimize EDA workload runtime and maximize cost efficiency in the cloud. These solutions are tailored to streamline workflows, enabling customers to leverage the flexibility, scalability, and agility of cloud computing while reducing learning curves and minimizing trial-and-error efforts. When deploying EDA workloads to the cloud, various factors must be considered, such as selecting appropriate cloud VMs (Virtual Machines) for different workloads, and properly configuring the scheduler and storage. TSMC and Cloud Alliance partners offer application note on acceleration methodologies, which are valuable resources containing detailed methodologies, tool execution settings, and performance optimization results. All of these application notes are available for download through TSMC-Online. Application Notes Available for Download from TSMC Online: Physical Verification: - TSMC DRC Sign-Off in the Cloud with Calibre® nmDRC™ (Azure) - TSMC DRC Sign-Off in the Cloud with IC Validator™ (Azure) - TSMC DRC Sign-Off in the Cloud with Pegasus™ (Azure) Timing Sign-off: - TSMC Timing Sign-Off in the Cloud with PrimeTime® and StarRC™ (Azure) - TSMC Timing Sign-Off in the Cloud with Tempus™ and Quantus™ (Azure) Multi-Physics Analysis: - TSMC Mechanical Stress Analysis in the Cloud with Ansys® Mechanical™ (Azure) - TSMC Multiphysics Analysis in the Cloud with Cadence® Tools (GCP) Silicon Photonics: - TSMC Optical Simulation Acceleration using GPU in the Cloud with Ansys® FDTD (Azure) - TSMC COUPE Optical Design Acceleration using GPU in the Cloud and AI with Ansys® (Part of Synopsys®) Tools (Azure)
