Contract Manufacturing and Development Lab Serving Europe's Advanced Photonics and Microelectronics Packaging and Assembly Needs Our European Advanced Solutions Division, strategically located in the heart of Europe – Germany, meets the European requirements for advanced packaging and assembly. With decades of experience in bringing solutions to well-established manufacturers throughout Europe, Palomar is well equipped to guide customers through their process development and prototyping. The services offered to customers extend beyond just process development and support, as the European Assembly and Test Lab is equipped for low volume contract manufacturing as well. Palomar's Advanced Solutions Division aims to help customers become leaders in their market by providing state-of-the-art equipment in our Europe lab which is capable of Die Attach (Eutectic, Epoxy, Ag Sintering, UV, Flip Chip & Vacuum Reflow) and Wire Bonding (Gold wire, Gold Ball Bumping) and Testing (Wire Pull, Die Shear, Ball Shear). Our laboratory offers: - Process development for your new processes - Development support - Prototyping - Production of your product - Palomar Bonder demonstration - Lowering time to SOP - Feasibility study Die Attach: Epoxy Die Attach (Conductive, Non-conductive, UV cure, Snap cure, Anisotropic adhesive); Eutectic Die Attach (Preform, Pre-deposited / Back-side metalized, Solder paste, Void-free soldering, flux-free attach); High Accuracy Component Placement; Flip Chip; Thermocompression. Machines used: Palomar 3880-II Die Bonder, 8301 SST Vacuum Reflow Oven. Wire Bonding: Gold Wire, Gold Ball Bonding; Gold Ball Bumping; Stud Bumping; Ultrasonic Wire Bonding; Deep Access Wire Bonding. Machines used: Palomar 8100 Wire Bonder. Additional Capabilities: Wire Pull Testing; Die/Shear Testing; Epoxy Curing Oven. Machines used: XYZTEC Pull and Shear Tester, Heraeus Curing Oven.
