By BE Semiconductor Industries N.V.
The use of leadless packages grows rapidly due to increasing component density. QFN/DFN packages have the disadvantage that the solder connection can only be inspected using x-ray processes, rather than Automated Optical Inspection (AOI). For the Automotive industry the AOI option is essential. Besi introduces together with chemical partner Sytron a complete solution to ensure AOI is possible for QFN/DFN packages. Processing ensures: - Immersion Tin plating (autocatalytic process) on full QFN/DFN Cu surface. - 100% solderability pass after 16hr dry bake. - 100% solderability pass after 8hr steam aging. - No exposed Cu areas. Equipment: - Handling of Tape Ring with singulated QFN / DFN packages (8” / 10” / 12”). - 20 Tape Rings per hour. Excellent solderability on full Cu surface 16 hours bake @ 150 o C 8 hours steam aging 100% solderability on pad 100% solderability on pad 100% solderability on side lead 100% solderability on side lead
