Park Systems

SIMON is specifically designed for routine measurement tasks. Its simple user interface and robustness of a fixed angle ellipsometer enables the entry to imaging ellipsometry. It can be operated in two different modes. The microscopic mode is very fast and allows visualisations of variations and defects in the thinnest layers (e.g., monolayers: d = 0.35 nm), whereas the ellipsometric mode measures thickness and the refractive index of the sample materials. Imaging Ellipsometry itself combines the sensitivity of thickness and refractive index measurements with the imaging capabilities of microscopy. This allows for determining thickness and refractive index variations with microscopic images of e.g., micro-structured samples. Typical applications include the surface inspection of homogeneities and defects in large samples in quality control or the fast localization of flakes of 2D materials.

Accurion EP4, our latest imaging ellipsometer, combines ellipsometry and microscopy for precise characterization of thickness and refractive index on microstructures as small as 1 µm. Unlike conventional ellipsometers, all structures inside the field of view are measured simultaneously. The EP4 provides ellipsometric-contrast live-view, allowing detection of sub-nm features and identification of regions of interest for obtaining values and 3D maps of thickness (0.1 nm - 10 µm) and refractive index. Additional accessories are available to expand measurements under controlled conditions or temperature variations.

Park NX-Wafer is the leading automated AFM system in the semiconductor industry. It offers comprehensive wafer fab inspection, defect review, and CMP profiling. Park NX-Wafer boasts the highest nanoscale surface resolution, consistent sub-angstrom height accuracy, and superior tip sharpness with minimal variation. Its features like auto tip exchange, live monitoring, markless target positioning, and automated analysis, make it a top-tier tool for semiconductor wafer applications.