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EnergyOctober 30, 2026 · 2 min read

3nm ALD AlOx Buffer Protects Perovskite Tandem Cells During ITO Sputtering

3nm ALD AlOx Buffer Protects Perovskite Tandem Cells During ITO Sputtering. Credit: Kurt J. Lesker Co. Ltd.
3nm ALD AlOx Buffer Protects Perovskite Tandem Cells During ITO Sputtering. Credit: Kurt J. Lesker Co. Ltd.

Researchers from the Institute for Photovoltaics at the University of Stuttgart, with collaborators from Forschungszentrum Jülich, INL Braga and AIKO Europe, have shown that an approximately 3 nm atomic-layer-deposited aluminium oxide (AlOx) buffer can protect perovskite-silicon tandem solar cells during indium tin oxide (ITO) sputtering. The work was carried out on an integrated inert-atmosphere processing platform supplied by the Kurt J. Lesker Company.

Thermal ALD was used to deposit AlOx directly onto the C60 electron-transport layer before ITO deposition by pulsed-DC magnetron sputtering. The optimum AlOx thickness was approximately 3 nm, corresponding to 38 ALD cycles. The film formed a dense, conformal coating that protected the device stack during sputtering.

In the reported comparison, thin SnOx films more frequently showed incomplete coverage and pinhole formation. Within the device architecture and process conditions investigated, the approximately 3 nm AlOx layer provided effective sputter protection compared with an approximately 20 nm SnOx buffer layer, a reduction of approximately 85% in nominal buffer-layer thickness.

Semi-transparent perovskite solar cells with the ultrathin AlOx protection layer reached power-conversion efficiencies above 17%. Monolithic perovskite-silicon tandem devices exceeded 26%, with independent reporting citing a tandem efficiency of approximately 26.9%. In an initial thermal-stress test, devices were held at 85 °C in dry air for four hours; AlOx-buffered devices showed approximately 1.6% relative efficiency loss, against approximately 8.0% for SnOx-buffered devices.

The ultrathin AlOx layers were deposited using a glovebox-integrated KJLC ALD150LE before transfer to sputtering. The platform connects solution processing, thermal evaporation, ALD and sputtering through glovebox environments, allowing sensitive samples to move between process stages without exposure to ambient air. The researchers state that longer-duration reliability studies would be needed to assess commercial lifetime.

Source: Kurt J. Lesker Co. Ltd. news

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