The ATC-HY Multi-Chamber Hybrid Deposition Tool combines two Hybrid Process Chambers, each featuring e-beam and thermal evaporation, confocal magnetron sputtering, ion beam etching with a 360 degree tilt, and a water-cooled substrate holder. In addition, a third process chamber features post anneal, oxygenation and ashing capability. All are connected via a UHV magnetic transfer tube with sectional isolation, integral load-lock and glovebox compatibility.
