The ATC-MC Multi-Chamber Magnetron Sputtering System allows automated in-situ transfer between two UHV deposition chambers each equipped with (5) 3” con-focal sputtering sources, (1) 6” direct sputtering source, and (1) 4cm gridded DC ion source.Sputtering sources are powered by DC, RF, and HiPIMS generators. System is designed for up to 8” wafer handling, 800C heating, 0-40 RPM azimuthal rotation, RF/DC biasing, and 100mm z-motion adjustment. Additional features include custom bakeout jacket for chamber conditioning (< 9.0x10-10 Torr), turbo/cryo pump combination, automated crystal monitor positioning for rate calibration and data logging, and post wafer cooling via He gas.
