By LayTec GmbH
Our software for control, analysis and optimization of epitaxial processes. EpiNet® is LayTec’s proprietary software for control, analysis and optimization of epitaxial processes in production and development of LEDs, laser diodes, VCSEL, HEMT, HBT and other electronic and optoelectronic devices. The software extracts key figures about wafers’ behavior during growth. In run-to-run control and in statistical process control, these key figures are used to improve yield and process capacity. EpiNet®can be integrated into automated fab workflow providing any desired level of information from simple plain-text files to sophisticated live SECS/GEM integration. Fields of application - In-situ process control with ex-situ accuracy even for very thin layers - Control of complex production processes on operator level - Fast in-spec/out-of-spec indication for stop or go decisions - High automation saves operator time, eliminates error sources and makes in-situ control easy without training - Engineer’s access level for sophisticated data analysis - High customization Product features - User-friendly visualization of measured data - Active real-time GOLDEN RUN analysis - Toolbox of diagnostic algorithms for all relevant process steps - Flexible configuration for epi fab-wide SPC (statistical process control) and FDC (fault detection & classification) - Tight in-house control of your confidential recipes - Full linescan capability - Integration into growth system software is possible - User-defined wafer-zones uniformity analysis - Ever-growing set of analysis algorithms for in-depth analysis of your particular deposition process - Interactive and recipe-controlled analysis of growth rate, layer thickness and optical constants - Display of measurements as time-resolved data sets, line scans and color plots - Fab integration & advanced process control - PocketGuard for advanced process control - Quick check of all monitored wafers during the run at one glance - All wafers are color-coded by user-defined in-spec/out-of-spec criteria and visualized as they are positioned on the susceptor - In-spec/out-of-spec criteria can be set for all LayTec‘s analysis features - Wafer-to-Wafer view for post-run analysis - Time-resolved transients, color plots and line scans - For Operators: Use of pre-configured analysis recipes & automated start of in-situ measurements - Customized run type management via EpiNet®’s configuration panel: Visualization of susceptor geometry and wafer-specific settings for each pocket EpiNet® is LayTec’s standard metrology software for deposition monitoring using metrology tool of the EpiCurve TT family. It is shipped in its basic license version with every metrology system.
Combine measurements of temperature and reflectance at three wavelengths in one tool. EpiTT combines measurements of temperature and reflectance at three wavelengths in one tool. For True Temperature (TT), we apply the method of emissivity corrected pyrometry, which delivers the precise surface temperatures of opaque materials at 950 nm (Si, GaAs, InP). For materials that are transparent at 950 nm (GaN, Sapphire, SiC), EpiTT measures the temperature on the top side of the carrier. Measuring reflectance at three wavelengths monitors all essential properties of the growing layers, such as growth rate, film thickness, stoichiometry changes and morphology. EpiTT offers industry standard metrology for all kinds of epitaxial growth systems and is compatible with different main rotation frequencies in the range from 5-1500 rpm. Fields of application - Temperature range: T=450°C to 1300°C for large viewport systems/T=500°C to 1400°C for narrow viewport systems/other temperature ranges on request, e.g. 1500°C for UV LED applications, 1700°C for SiC - Wafer temperature with precision better than ±1K in a range of 600°C to 1400°C - Wafer and area selective measurements - True wafer temperature for opaque semiconductors such as InP, GaAs and Si - Pocket temperature for GaN, Sapphire and SiC Product features Emissivity corrected pyrometry: - Temperature range from 450°C to 1300°C for large viewport systems/500°C to 1400°C for narrow viewport systems / other temperature ranges on request, e.g. 1500°C for UV LED applications, 1700°C for SiC - Accuracy better than 1 K - Wafer and area selective measurements - True wafer temperature for opaque semiconductors such as InP, Graphite (SbS) - Pocket temperature for GaN, Sapphire and SiC Reflectance at three wavelengths: - 950 nm, 633 nm and 405 nm - Growth rate, layer thickness, roughness and other layer qualities - Full performance up to 1500 rpm main susceptor rotation - Further wavelength (e.g. 280nm, 365nm, 1550nm) for special applications are available on request
CATEGORY
X Link® enables fast, automated, non-destructive and accurate evaluation of the level of EVA or polyolefin cross-linking in PV module encapsulation processes. In solar modules, the ethylene vinyl acetate (EVA) or polyolefin encapsulation protects the sensitive solar cells from the environment. In consequence the degree of intermolecular cross-linking of EVA or polyolefin is decisive for the long-term stability and performance of a module. Cross-linking is achieved by thermally curing the polymers during the lamination process. The X Link® system enables fast, automated, non-destructive and accurate evaluation of the level of EVA or polyolefin cross-linking immediately after lamination. It can be integrated into any solar module production site, offering a flexible platform for encapsulation quality control ranging from single point sampling to full module mapping. The stand-alone version is designed for lab applications, manual product sampling, areal mappings, R&D labs and pilot lines, ready to test full-size production-type modules with or without frames. High-resolution spatial mappings of the cross-linking degree and statistical evaluation can be performed. Furthermore, the manual off-line version allows multiple-point measurements on laminates and out-of-production modules, and modules from the field. This setup is a highly useful quality control tool for incoming goods inspection for EPCs, certifiers and consultants. Fields of application - Module encapsulation quality control in glass/backsheet solar module production Product features - Non-destructive test procedure - Testing time of only seconds per measurement points - Flexible module mapping capability - Data output in “% gel content”
CATEGORY
Both emissivity-corrected temperature monitoring and reflectance measurement at three wavelengths are included in all products in our EpiCurve® TT family of products. For reactors with multiple wafer ring configurations, the models with two or three EpiTT heads (EpiCurve®Twin TT and EpiCurve®Triple TT) allow for temperature and reflectance measurements at two or three independent positions respectively.
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All products in the EpiTT family (EpiTT, EpiTwin TT, EpiTriple TT) are available for various MOCVD growth systems such as: - Systems with satellite rotation - Showerhead-like systems - Systems with main susceptor rotation speed up to 1500 rpm - R&D type and customized MOCVD growth systems
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