Through Intersurface Dynamics, we manufacture and sell application-specific chemicals used to achieve specific surface morphologies on a variety of materials.These chemicals are used in a variety of applications and industries including semiconductor, semiconductor materials, precision optics and ceramics and mirror manufacturing.
High volume solder reflow equipment used by leading OSATs and OEMs for advanced packaging of most AI semiconductor devices
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Through Entrepix, Inc. we offer double sided 200mm wafer cleaning systems used for both silicon and compound semiconductor applications. These cleaning systems are used in process steps including post-CMP clean, pre-bond clean, pre-photo clean, post-ILD deposition, and advanced packaging applications.
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Through Bruce Technologies, we manufacture and sell 200mm and 300mm horizontal diffusion and deposition furnaces, which address several steps in the semiconductor manufacturing process, including diffusion, LPCVD, high-temperature oxidation, and annealing. Bruce Technologies’ 300mm HTR furnace is a leader in HTR diffusion for power semiconductors.
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Through BTU International, we manufacture and sell process specific controlled atmosphere belt furnaces used for many thermal process applications such as brazing, sintering and curing. These systems serve high-volume applications primarily in the electronics and automotive (EV, HEV, and ICE) end markets and are known for their superior control of temperature and process atmosphere.
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