High volume solder reflow equipment used by leading OSATs and OEMs for advanced packaging of most AI semiconductor devices
Through Entrepix, Inc. we offer double sided 200mm wafer cleaning systems used for both silicon and compound semiconductor applications. These cleaning systems are used in process steps including post-CMP clean, pre-bond clean, pre-photo clean, post-ILD deposition, and advanced packaging applications.
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Through Bruce Technologies, we manufacture and sell 200mm and 300mm horizontal diffusion and deposition furnaces, which address several steps in the semiconductor manufacturing process, including diffusion, LPCVD, high-temperature oxidation, and annealing. Bruce Technologies’ 300mm HTR furnace is a leader in HTR diffusion for power semiconductors.
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Through BTU International, we manufacture and sell process specific controlled atmosphere belt furnaces used for many thermal process applications such as brazing, sintering and curing. These systems serve high-volume applications primarily in the electronics and automotive (EV, HEV, and ICE) end markets and are known for their superior control of temperature and process atmosphere.
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Through P.R. Hoffman, we manufacture and sell a wide range of products, including substrate carriers, substrate polishing templates, and CTX chemically resistant templates used for Silicon Carbide substrates. Through Entrepix we participate in chemical mechanical polishing (CMP) as a solutions provider for 200mm CMP equipment and a foundry operator serving some of the leading IDMs and OEMs.
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