The dual UHV Sputtering System above allows transfer between deposition chambers without exposure to load-lock pressures. Common 2-position load-lock chamber (e10-7 Torr) is located on the far right, oxide chamber (e10-8 Torr) in the center, and UHV sputter chamber (e10-10 Torr) with bakeout jacket on the left. The UHV chamber includes both con-focal and direct sputtering optimized for deposition of superconducting Nb films. The oxide chamber includes (5) con-focal 2” sputtering sources, O2 plasma source, and both static and dynamic natural oxidation capabilities.
