By Soitec
Imager-SOI enhances image quality and reduces power consumption Soitec's Imager-SOI is designed to enhance image sensor performance and integration in cameras and other imaging devices. It provides a compact solution where high resolution 3D images and small form factor are desired. It is an attractive option for advanced imaging applications across a range of devices, including consumer electronics, automotive cameras, medical imaging and professional photography. Enhanced Imaging Performance & Sensitivity Imager-SOI technology provides superior light absorption and image resolution, enabling high-quality imaging even in low-light conditions. These features are desired for multiple applications, including consumer electronics, automotive, and industrial imaging systems. Higher Integration The technology allows for the integration of image sensors with advanced silicon electronics on a single substrate, facilitating the development of compact and high-performance imaging solutions. Reduced power consumption By leveraging the SOI substrate, Imager-SOI reduces power consumption and heat generation, which is crucial for battery-operated devices and systems requiring efficient operation. In smartphone cameras, Imager-SOI is adopted to handle 3D facial recognition for security access. In Advanced Driver Assistance Systems (ADAS), Imager-SOI is ideal as an Imaging technology enhancing vehicle safety and driving experience through various features. In smart home and smart city applications Imager-SOI offers high performance to Imaging sensors to enable object recognition and detection. Imager-SOI enhances imaging performance and sensitivity, higher Integration, reduced power consumption, and better thermal management in an imaging device.
For the most performance demanding consumer products, Soitec’s RF-SOI products help reliably boost the RF signal strength while Soitec’s POI products help filter unwanted signals and interferers. As everyday devices become smarter, CMOS compatible Soitec’s RF-SOI products help add control and reconfigurability capabilities to their RF Front End for performance enhancement. Embedded in 100% of mobile 5G and selected Wi-Fi products. Soitec’s RF-SOI substrates are essential for effective and efficient RF signal routing.
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Explore FD-SOI and PD-SOI which offer high speed data computation with low power consumption and analog integration in a networking application or Qubit processor in Quantum computing. PD-SOI enables higher switching speeds and improved transistor performance which are crucial for executing complex computations and high-frequency operations in high end systems.
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Soitec's Power-SOI empowers electric and autonomous vehicle innovation. Our industry-leading engineered substrates enable the development of advanced automotive applications, delivering superior energy efficiency, performance, robustness, integration, sustainability, faster time-to-market and intelligence. It meets enhanced FuSa standards and 48V architecture requirements. Power-SOI Features & Benefits High voltage & low voltage integration on the same die: Power-SOI with DTI (deep trench isolation) enables integration of high and low voltage blocks on a single die, minimizing die area. High temperature operation: Power-SOI's superior low leakage at high temperatures enhances temperature margins, facilitates AEC-Q100C Grade 0 certification, and improves device accuracy. High robustness: Power-SOI's excellent noise immunity, latch-up-free structure, and enhanced ESD/EMI/EMC properties enable high-performance power ICs that meet stringent robustness requirements. Simple device design: Power-SOI simplifies device design, reducing mask count and eliminating complex well structures. It also improves BV-Rsp performance through double RESURF High Efficiency: Power-SOI technology often enables devices to work with higher efficiency by offering the lower on resistance (RDSon) and lower reverse recovery charge (Qrr). This benefit is crucial for energy-sensitive applications, particularly in automotive and mobile devices, contributing to longer battery life and energy-efficient performance. Scalability for Future Nodes: Power-SOI is highly scalable for future technology nodes, making it adaptable to evolving needs in semiconductor manufacturing. This scalability ensures that Power-SOI will remain relevant in future generations of ICs, allowing for integration of new functionalities without increasing die size or complexity. Connecting the world with Soitec Power-SOI substrates Soitec's Power-SOI substrates enable smart power management in electric vehicles (EVs) and advanced driver-assistance systems (ADAS), meeting high functional safety standards and supporting 48V low-voltage architectures for better efficiency. Their robustness and high-temperature tolerance make them ideal for powertrain and under-hood components. In industrial applications, Power-SOI substrates offer durability, noise immunity, and energy efficiency, simplifying power IC design by integrating high- and low-voltage components. They are essential for reliable operation in harsh environments, particularly in motor drives, inverters, and automation systems. Power-SOI substrates enhance energy efficiency and performance in datacenters and network infrastructure by supporting efficient power supply circuits and high-speed signal processing. Their ability to operate in high-temperature environments ensures reliable performance in demanding computing and telecommunication systems. Highlights Efficient smart power IC: Power-SOI improves 10% system cost and smart power IC efficiency. Safer smart power IC: Power-SOI facilitates smart power IC development, meeting high robustness, noise immunity, and operating temperature requirements. Better performance smart power IC: Power-SOI improves 10% system cost and smart power IC efficiency. Increased Voltage Handling Capacity: Power-SOI enables high voltage isolation capabilities, supporting up to 200V in smart power ICs. This allows for better integration of high-voltage and low-voltage components on the same die, which is essential in applications like power converters and motor drivers. Frequently asked questions Which applications use Power-SOI? - IVN (In-vehicle Networking) such as CAN, LIN, FlexiRay, Ethernet Phy ICs - PMIC (Power Management IC)/ SBC (System Basis Chip) - BMIC (Battery monitoring IC)/ BMS AFE (Battery management system analog front end) - Gate driver IC - Smart actuator/ smart motor controller IC - Industrial interface IC - HiRel (High Reliability) IC etc. What are the benefits of using Power-SOI? - To enable high integration of high voltage circuits and low voltage circuits on the same die for saving die area - To provide high robustness and reliability for meeting higher functional safety (FuSa) requirements - To ease the IC design with increasing demands of wider operating temperature and higher FuSa requirements - To shorten the IC development time by ensuring higher percentage of first time right design which improves the time-to-market - To improve the efficiency of the power IC by reducing the conduction losses and switching losses What are the key inflections that Power-SOI addresses? - The new 48V low voltage architecture: Power-SOI enables higher breakdown voltage (BV) which is needed for this architecture (said 200V BV) - Increasing demands for higher functional safety (FuSa): Power-SOI enables the integration of high voltage circuits and low voltage circuits by providing excellent noise immunity with DTI & BOX, latch-up free structure and significant reduction of isolation area - Package downsizing: Power-SOI low leakage current at higher junction temperature and much smaller die size allow the use of smaller package size How many product families are inside Power-SOI product portfolio? 200mm Power SOI - Smart Power 1.5: SmartCut ™ SOI EPI ready only up to 1.5um SOI thickness with BOX up to 3.0um - Smart Power 2.0: SmartCut ™ SOI + EPI (up to 10 um) with BOX up to 3.0um - Smart Power 2.1: SmartCut ™ SOI + EPI (up to 10um) with 3.1um to 3.9um BOX 300mm Power SOI - Smart Power 3.0: SmartCut ™ SOI EPI ready only up to 0.2um SOI thickness with BOX up to 2um - Smart Power 3.1: SmartCut ™ SOI + EPI (up to 7um) with BOX up to 2um
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Photonics-SOI from Soitec is an advanced technology platform that integrates photonic components on a silicon-on-insulator (SOI) substrate to enhance optical communication capabilities. Photonics-SOI offers significant advantages for optical transceivers, including high data rates, cost efficiency, power savings, compact size, and improved signal integrity. These benefits make it a compelling choice for high-speed data center interconnect applications. Photonics-SOI provides several advantages for personal healthcare sensors, including miniaturization, cost efficiency, high sensitivity, and integration capabilities. These benefits enable the development of advanced, compact, and accurate monitoring devices for health applications. Photonics-SOI is used in Light Detection and Ranging (LiDAR) devices which are increasingly being used in Advanced driver-assistance system (ADAS), mobile and consumer applications. Photonics-SOI enables the implementation of Quantum Key Distribution (QKD), a method for secure communication based on quantum principles. Silicon-based photon sources and detectors can be used to create and distribute quantum keys between parties, ensuring secure data transmission. Enhanced Bandwidth and Speed The technology supports high-bandwidth and high-speed optical communication, addressing the increasing demands for data transfer in data centers, telecommunications, and computing systems. Integration and scalability By leveraging silicon’s established manufacturing processes, Photonics-SOI supports scalable production and seamless integration with existing silicon electronics, facilitating the development of compact, high-density optical systems. Reduced power consumption Photonics-SOI contributes to lower power consumption by utilizing optical signals for data transmission, which is more energy-efficient than traditional electrical interconnects, especially over long distances. Soitec provides innovative solutions for high speed and robust connectivity in data center interconnect and network infrastructure connectivity. By offering superior thermal management and reduced power consumption, Soitec's substrates help optimize the operation of servers and networking devices, enabling faster data processing and lower energy usage. Soitec offers a portfolio of solutions which enhance the performance and efficiency of Edge AI and IoT applications. By providing high-quality, energy-efficient substrates, Soitec helps to optimize IoT devices by enhancing their reliability and extending battery life, making them ideal for real-time data processing and communication in various applications. Soitec empowers electric and autonomous vehicle innovation. Our industry-leading engineered substrates enable the development of advanced automotive applications, delivering superior energy efficiency, performance, robustness, integration, sustainability, faster time-to-market and intelligence. Soitec empowers smart industrial applications and enables industry leading industrial automation. Our industry-leading engineered substrates enable the development of advanced industrial applications, delivering superior energy efficiency, performance, robustness, integration, sustainability, faster time-to-market and intelligence. Current world’s semiconductor capacity and the demonstrated large scale manufacturability of engineered substrates have provided the possibility for every person in the world to afford at least one device - a smartphone for most - able to acquire, process and communicate information of its surroundings. As the leader in engineered substrates, Soitec is helping enterprising customers and partners in ensuring that their products meet the ever-increasing expectations in consumers' Quality-of-Experience. Our engineered substrates help ensure end-to-end energy efficiency, fast, secure and reliable data acquisition and processing and robust broadband connectivity. In what applications is Photonics-SOI being used? Photonics-SOI is used in a wide range of applications from data center interconnect, LiDAR, personal healthcare to quantum technologies. What are the benefits of using Photonics-SOI in an optical transceiver? Photonics-SOI offers the advantages of enhanced bandwidth and speed, higher integration and scalability, and reduced power consumption.
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