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MHA100KN High Performance Low Power Hall-Effect Sensor

By MEMSIC Inc.

High Performance Low Power Hall-Effect Sensor MHA100KN FEATURES - Low power CMOS process - Wide operation voltage range: 1.65~5.5V - Ultra-low power consumption, <5uA@1.8V - Good RF noise immunity - Omnipolar operation - Dual output, Unipolar Hall switch for N and S - -40 C to +85 C operation - RoHS compliant - DFN4 package with 1.0mmx1.4mmx0.37mm APPLICATIONS - TWS headset - Smart meter - Cover switch SPECIFICATIONS (Measurements @ 25 C, unless otherwise noted; V DD =1.8V unless otherwise specified) Supply Voltage (V DD ): Min 1.65, Typ 1.8, Max 5.5 V Supply Current: 2.5 Typ, 5.0 Max μA; -40~85 C 2.5 Typ, 10.0 Max μA Power Down Current: 1.0 nA Operating Temperature: -40 Min, 85 Max C Storage Temperature: -55 Min, 125 Max C Awake Tim (T awake ): 50 Min, 100 Max μs Period (T period ): 50 Min, 100 Max ms Duty Cycle: 0.05 % Output High (V OH ) IOUT =+0.5mA: VDD -0.3 Min, VDD -0.1 Typ, VDD +0.1 Max V Output Low (V OL ) IOUT =-0.5mA: -0.3 Min, 0.1 Typ, 0.3 Max V Output Current: -0.5 Min, 0.5 Max mA Magnetic Opening Point (B OP ): 27 Min, 37 Typ, 47 Max Gauss Magnetic Releasing Point (B RP ): 20 Min, 30 Typ, 40 Max Gauss Hysteresis Window (B HYS ): 2 Min, 7 Max Gauss ORDERING GUIDE MHA100KN PIN DESCRIPTION Caution: Electro Static Discharge (ESD) sensitive device. PACKAGE ILLUSTRATION DFN4 package with 1.0mmx1.4mmx0.37mm size. Pin NO. Pin Name Description 1 VDD Power supplier 2 VSS Connected to Ground 3 OUT2 S pole detection output 4 OUT1 N pole detection output Package type Code Type NDFN package Performance Grade Code Temp K-40 ~ 85 C HARDWARE DESIGN CONSIDERATION It is necessary to keep VDD voltage clean for best noise performance. A low-ESR bypass cap is required and recommended value is 0.1μF. It should be placed close to the device as much as possible. LAND PATTERN 1. The device routing should be symmetric. 2. Recommended land pattern of PCB is shown in Figure 3. 3. Thickness of stencil should be 0.1mm. THEORY OF OPERATION This Hall switch is fully integrated CMOS IC. It output high-low signal following magnetic field changing. Normally it works with a magnet and detect the magnet close and away. SOLDER REFLOW PROFILE 1. Reflow is limited by 2 times. Second reflow should be applied after device has cooled down to room temperature (25 ℃). 2. Recommended reflow profile for Pb free process is shown in Figure 3. The time duration of peak temperature (260 ℃) should be limited to 10 seconds. 3. Type 4 solder paste is recommended for a better SMT quality. MANUAL SOLDERING 1. Soldering/repairing MHA100 manually via solder iron or heater gun is not recommended. 2. Avoid bending or torqueing the PCB after the sensor is assembled. PACKAGE OUTLINE DIMENSION Notes : a) Sensitive area located at the center of package within 0.3mm diameter circle. b) ePAD can be tied to the VSS or Floating. c) Unless otherwise specified, Tolerances is ±0.05mm. TAPE AND REEL PACKING Products are put into carrier tape according to marking direction. The quantity for each full reel is 4000pcs per reel with 7” lock reel. Please refer to Figure 6 Details for tape and reel packing as below: a) MHA100 tape and reel carriers are in accordance with ANSI/EIA-481 b) Product pin 1 orientation: Upper Left c) Tape and reels are NOT designed to be baked at high temperatures d) Each tape and reel is typically dry packed in a moisture barrier bag (MSL1).

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