System features both sputter and evaporation process chambers with (10) A315-O 1.5"UHV sputter sources, (1) 6-pocket 15cc UHV linear e-gun, (4) Resistive Thermal Sources, 850°C rotating substrate heaters with RF bias, secondary tilting/cooled stage, RHEED, computer control, load-lock cassette with in-situ mask exchange for 4" diameter substrates and chamber to chamber transfer system.
