ATC-2200-HY UHV Hybrid Deposition System with XPS integration The ATC-2200-HY Hybrid Deposition system is equipped with (5) 2” con-focal sputtering sources, (1) 3” direct sputtering source, (1) 6-pocket 15cc linear electron beam gun, and (1) 4cm gridded DC ion source.The system is designed to accommodate up to 3” wafer handling, 850C heating, azimuthal rotation, RF/DC biasing, 100mm z-motion, and in-situ mask exchange mechanism.In addition the system has an appendage chamber that allows the user to disengage the mask, flip the substrate 180 degrees, and in-situ transfer into an XPS system for chemical and elemental analysis.
