Nova WMC

By Nova Measuring Instruments

Next Generation Modular Optical Metrology Platform for Advanced Packaging Nova WMC is a high-end optical metrology platform designed to support 2.5D and 3D Advanced Packaging processes. Through the highly versatile modularity of its advanced metrology, handling, and loading systems, it combines precision, accuracy, and high throughput for outstanding performance at an unmatched Cost of Ownership. The platform’s unique ability to address major challenges such as high warpage, non-symmetric shapes, and different surface conditions, all in one tool, makes it the ultimate choice for 2.5D/3D packaging and HBM manufacturers. Highlights and Benefits Powerful Metrology Utilizing a range of high-end optical sensors (Interferometry, Reflectometry, and more), Nova WMC can serve as a cross-process, one-stop metrology solution (e.g., HBM manufacturing) Outstanding Performance Nova WMC combines fast, repeatable scanning with large-area mapping at nanometer fidelity and uses adaptive focus technology for stable measurements on warped or non-uniform surfaces. Versatile Handling Designed to support different wafer sizes, framed wafers, and panels. With customizable load port configurations and end effectors, Nova WMC can handle multiple advanced packaging scenarios. Automated Workflows With SEMI-compliant connectivity, it integrates seamlessly into fabs’ automation environments, while supporting automatic recipe loading and centralized recipe management for efficient operation. Future Ready Nova WMC’s future-ready metrology technology, together with its highly flexible system design with in-field upgrade capability, supports the evolving process challenges and customer needs. Why Nova WMC? Nova WMC redefines wafer metrology for advanced packaging by delivering a unified solution to the most complex challenges in 2.5D/3D integration and HBM manufacturing. Built on a modular, future-ready architecture, it seamlessly adapts to evolving process demands while maintaining exceptional precision and throughput. Its unique multi-sensor approach—featuring in-house-developed optical technologies—enables accurate, repeatable measurements across diverse surface conditions, including warped or non- uniform surfaces. Nova WMC’s versatility extends to handling a wide range of wafer sizes and formats, ensuring compatibility with the full spectrum of advanced packaging workflows. With robust automation, SEMI-compliant integration, and scalable performance, Nova WMC empowers fabs to accelerate yield, reduce cost of ownership, and confidently navigate the next generation of semiconductor innovation. Applications Backside Silicon Thickness Pre / post grind and post CMP Silicon thickness, c overing a range of 1 to 1000 µm. H igh-throughput measurements with full wafer mapping for complete thickness profile analysis. Wafer Warpage Detailed full-wafer warpage mapping provides a comprehensive view of wafer deformation. Bow measurements are performed at selected key points to quickly assess wafer curvature. Bond Layer TTV Single-layer measurements can be performed on multi-layer samples, such as the adhesive bond layer between the wafer and the carrier. Bonding eccentricity is also detectable for alignment analysis. Topography Analysis Geometric parameters such as C ritical D imension (CD), height, and distance can be measured, including features like RDLs, bumps, and laser grooves. Die Warpage (3D, D2W) Die warpage and thickness can be measured, typically in cases like framed wafers after dicing. Key results include metrics such as SFQR, SBIR, and others. Planar Thin Film Fast full-wafer mapping enables efficient measurement of thin film thickness and calculates the Total Thickness Variation (TTV) across the entire wafer. The measurement instrument can evaluate the thickness of up to four thin layers, down to 5 nm, either on test windows of a product wafer or across a blank wafer.