Incorporates con-focal sputtering, a (6) pocket linear e-beam source, ion milling with SIMS end point detection, and a retractable sputter source for short working distance direct sputtering (e.g. Nb superconductors). This UHV tool is equipped with a +/- 200° tilting substrate holder that can be equipped with various features such as heating, cooling (LN2/H2O), rotation, and RF biasing.Additional features include load-lock oxidation, glove box integration, ellipsometry, and in-situ crucible exchange of the e-gun.
