AJA International ATC-T Series Thermal Evaporation Systems are thin film deposition tools offering exceptional value while delivering optimal performance and utilizing top quality sub-components. They are available in both cylindrical (UHV) and box style (HV) configurations. These systems inherit many design features and common parts from the highly evolved ATC & ATC Orion sputtering tools and can be outfitted with AJA International's unique 300 Amp, water-cooled thermal evaporation sources, Knudsen cells, low temperature evaporation cells for organic materials and thermal evaporation furnace sources. In addition, these tools can include AJA magnetron sputter sources, load-locks, QCM control, heated or cooled substrate holders, planetaries, various pumping packages and automated control. ATC-T Series Thermal Evaporation Systems can be configured for high and low rate/temperature applications. Controlled co-deposition is also a specialty. Proper substrate fixturing/motion is ideal for optimizing uniformity. Substrate Holders - Heating/Cooling: AJA can fit your customized evaporation system with a wide variety of substrate holders. Our substrate heaters can be equipped with azimuthal rotation, heating up to 1000°C, RF/DC bias capability and tilting in a single axis plane. Our cooled stages can be equipped with H2O or LN2 cooling in the static or rotational modes. Additional features include azimuthal rotation, RF/DC bias and tilting in a single axis plane. Substrate holders can be semi-automatic or fully automated depending on the process requirements. Custom configurations are also available when heating and cooling are required. For batch coating applications, domed-styled substrate carriers optimized for lift-off processing and planetary-style holders, are also available. Process gas ring or gas distributor options are offered for reactive processing or applications requiring an anneal step. Phase II-Au Computer Control: The AJA LabVIEW based Phase II-Au computer control system is used on all Evaporation Systems.This straightforward, user friendly control system utilizes a large 22” articulating screen with wireless keyboard and mouse. The back panel of the hardware module is populated with connectors to interface to all aspects of the sputtering system and to allow for easy future "plug and play" upgrades/expansions. The Phase II-Au control system allows the user to operate in either the “manual mode” or the “automated processing mode.” In the, “automated processing mode” the user designs "process layers” which are then compiled and saved as a “process” to be executed with a single command. The system allows up to 104 unique user entry points which are accessible only by password, limiting access to a user’s process layers and thereby preventing unexpected corruption of a user’s saved processes.Special “soak layers” can be easily incorporated into the process. Adjustable time base Data-logging to a Microsoft Excel spreadsheet is standard.Remote preparation of new processes in a Microsoft Excel spreadsheet emulator format is available as an option. The standard Phase II-Au control system will accommodate up to (3) DC power supplies, (3) RF power supplies, (1) 4-way DC switchbox, (1) 4-way RF switchbox,(1) DC Ion Source, (1) RF Ion Source, (1) Linear or Rotary Ebeam, (1) Deposition Controller,automatic selection of sweep pattern based on material, (4) process gases,(24) Valves/shutters, down stream closed loop automatic pressure control, substrate rotation,substrate tilting and indexing and substrate temperature control. Processes are aborted if plasma is not detected,substrate temperature, process gas or chamber pressure is out of range. System Options include: Planetary Substrate Holder, Domed-Style Holder Optimized for Lift-Off Processing, Load-lock Cassette, Bake-out Jacket, Ion Source, In-situ Refill Mechanism.
