By TSMC (Taiwan Semiconductor Manufacturing Company)
TSMC’s CoWoS®-S solution provides best-in-class package technology for ultra-high performance computing applications. Wafer-level system integration provides high-density interconnects and embedded deep trench capacitors over a large silicon interposer area to accommodate various functional top dies, including logic chiplets, with high-bandwidth memory (HBM) cubes stacked over it. CoWoS® has been in production since 2012, with its silicon interposer size reaching up to 3.3X-reticle.
