Backend die/wafer assembly and packaging.
Showing all 2 providers
Equipment & Instrumentation Manufacturers · 11–50 employees · United States
1 listed under this category
Custom MEMS chips and wafers
Novel electrode geometries and compositions, specialized window materials, custom thermal control layers, integrated fluidic channels, or entirely new device architectures. Designed and fabricated in our cleanroom. Capabilities: Electrode geometry · Window materials · Fluidic channels · Thermal control
Compiled from http://hummingbirdscientific.com
Component, Device & Product Manufacturers · 5,001–10,000 employees · Russia
5 listed under this category
Contract manufacturing of microcircuits
The GS Nanotech plant carries out the contract manufacturing of microcircuits. On a commercial basis, services are offered for the design and assembly of microcircuits, multichip modules and systems-in-a-case, and the packaging of microcircuits in various types of metal-polymer (BGA, LGA, QFN) and metal-ceramic cases. The result of this is that customers have access to the complete technological development of the project: from preparing the technical specification to receipt of the finished product. Manufacturing capacity at GS Nanotech: up to 20 million microcircuits per year.
Digital Television Systems
Assembly of electronic devices of any complexity: from surface-mounted components on a board to the packaging of the finished product
Contract manufacturing of electronics
GS Group can provide the full range of services for the development and production of electronics of any complexity: from packaging of integrated circuits to packing the finished products. These are unique opportunities for the Russian contract manufacturing market. DVTS offers contract manufacturing of a wide range of civil electronics, including the production of components for computer equipment.
Development and production of microelectronics
GS Nanotech is one of the most dynamically expanding private Russian research and manufacturing centres in the field of microelectronics. GS Nanotech is involved in the development and mass production of microelectronic products, including SiP (system-in-a-package) technology. The plant is fitted with modern equipment from leading global manufacturers. Production is certified according to ISO 9001:2015. The area of 7th class clean rooms at the enterprise is 700 m 2, expandable up to 1500 m 2.
Assembly
Installation of microcircuits on a printed circuit board using advanced technologies (Wire Bond, Flip-Chip, Stack Die, Package-on-Package, etc.) and final assembly of devices
Compiled from http://en.gs-group.com
