By Accumet Engineering Corporation
Accumet provides expert hybrid assembly and automated surface mount assembly services, along with professional support for prototype design and process development—helping you accelerate time-to-market and optimize assembly methods. Hybrid microelectronic assembly combines multiple technologies — such as thin-film or thick-film circuits on ceramic substrates, bare die components, wire bonding, and surface mount devices — into a single compact package. It is used when standard PCB assembly cannot meet the frequency, power density, thermal management, or size requirements of the application. Hybrid assembly is common in RF/microwave modules, high-reliability defense electronics, and medical implants where performance, hermeticity, or environmental durability requirements exceed what organic PCB substrates can provide. From initial specifications to prototype manufacturing, redesign, qualification, and full-scale production, Accumet is your partner at every stage. Rely on our experienced design team to deliver maximum system performance with cost-effective solutions for your most advanced integrated assemblies.
