By Applied Microengineering Ltd.
SOFTWARE AWB LIVE IN-SITU ALIGNMENT YOU SEE THIS IS WHAT Manual & Automatic live in-situ alignment down to 1 µm accuracy Wafers are aligned using visible or IR illumination, immediately prior to contact & bonding The live view provides visual confirmation and allows last-minute corrections, ensuring post-bond accuracy. Alignment can be carried out at any desired temperature, eliminating inaccuracies due to thermal expansion and mismatch between wafers. The central pin is used to prevent contact shift. Benefits of In-situ Alignment - All in One: Entire bonding process is done in one chamber without physically moving the wafers from aligner to the bonder - Adjust last minute: Possibility of making fine alignment adjustments just before contacting the wafers for bonding - Higher Throughput: Shorter cycle times – can align while system is being pumped down and wafers heated - Ability to re-align: Corrections possible – in some processes, if alignment at contact is not satisfactory, it’s possible to separate the wafers and start again - Align hot or cold: Can be carried out at any desired temperature, eliminating inaccuracies due to thermal expansion mismatch - No Contact Shift: Good “contact shift” control – alignment observed live while force is being applied to the wafers; also helped by using the central pin - Reliable Performance: Very useful for adhesive or glass frit bonding where low viscosity materials can be problematic while contacting the wafers Did you know? For backside alignment, an image capture option is available. Alignment can be performed manually or automatically.
