By Arcnano Inc.
Putting It All Together NDT Sensor NDT Sensor High Density Wire Bonds Mounted Die Assembly and Packaging Arcnano’s back-end services in both assembly and packaging cover the range from mechanical assembly to chip attach and 3D chip stacking. Our services include epoxy bonding, wire bonding and solder reflow as well as thermal bakeout, hermetic sealing, precision mechanical alignment and electrical testing. 3D Chip Stacking, Hybridization, Indium Bumping 3D Chip Stacks are vertical laminations of one chip upon another chip with electrical connectivity. Often referred to as hybridization, pioneered for Infra-Red Focal Plane Arrays (IR FPAs), this allows for a read-out IC (ROIC), typically CMOS, to be bonded to a compound semiconductor 2-D detector or emitter array. Arcnano specializes in IR FPAs, high power laser diodes, avalanche photo diodes or Si chip-on-chip. We perform backend processing including contact metallization, indium bumping, die singulation, hybridization and packaging. Arcnano makes its own SiC vacuum chucks, in-house, and also for much of the industry. FC-150 Chip Stacking Machine Indium Bumps Compound Semi Sensor - Silicon CMOS ROIC1024x1024 – Mega-Pixel-Bump Array SiC Chuck on FC-150
