By Arcnano Inc.
MEMS, Sensors, Thin Film Devices 3D Chip Stacking, Device Hybridization Wafer Scale Fabrication: Sputtering, Evaporation,CVD, ALD, Plating Deposition: Sputtering, Evaporation,CVD, ALD, Plating Patterning: Mask Design, GDS2 Format, Contact, Stepper, Direct Write Etching: Wet Etch, Dry Etch, Ion Milling, RIE, DRIE Bare Die: Dicing and Backside Thinning, Pick Out/Tape Out Advanced Packaging: 3D Devices, Flip Chip, Die Attach, Heat Sinking BEOL: Back End of Line FEOL: Front End of Line for MEMs, thin film devices
