Precision Deposition

Thin Film Deposition and Characterization Services

AJA International offers thin film deposition and characterization services in our applications lab. With our in-house tools and expertise, we can produce a variety of samples, from single test pieces to small batches. There are many instances when assistance in depositing thin films is valuable: * Testing with various materials and processes to jump-start research * Obtaining research samples based on techniques not available in-house * Proving out a coating before introducing it to manufacturing * Having expert assistance in determining deposition parameters * Gaining access to analytical tools to verify film properties * Carrying out pilot production runs * Providing demonstration samples when considering a system purchase As these jobs are all unique, please reach out to us about your needs!

Sputter-Up Multi-Wafer System (ATC-2200-UHV)

Substrates up to 8” diameter * Holders to accommodate multiple smaller substrates * “Sputter up” orientation * Base pressure 5 x 10-8 Torr * Six-position auto-loading cassette for fully automated runs * 5 UHV sputtering sources (A340-XP). Sources use 4” targets * One (1) 1500 W DC sputtering power supply * One (1) 600 W RF sputtering power supply * RF (100 W) and DC (1000 V) substrate bias capability * Quartz Crystal Monitor to calibrate deposition rates * Ar, N2, and O2 sputtering gases allow for reactive sputtering * Substrate heating to 800°C

Sputter-up System (ATC-1800-HV)

Sputter-up tool for samples up to 4” diameter * 5 x 10-8 Torr base pressure * Four (4) sputter guns, capable of sequential or co-deposition with all four guns * (2) Stiletto ST20 magnetrons for 2” targets * (2) Stiletto ST30 magnetrons for 3” targets * Quartz crystal monitor (QCM) for deposition rate calibration * A selection of power sources: DC, RF, pulsed DC, and HiPIMS * Process gas delivery: Ar, O2, N2. * Substrate heating up to 1,000°C with reactive gas ring and RF bias * k-Space Associates ICE thin film monitoring system (see below) * Load lock for fast sample turnaround * Large Wafer Direct Deposition Add-on Chamber * Full wafer direct deposition capability (up to 6”) * 6” magnetron for uniformity of coating * Sputter down orientation * Electrically isolated stage for DC bias * Same power supplies and process gases as in main chamber