By AMT&C Group (Advanced Magnetic Technologies & Consulting Group)
Plasma enhanced chemical vapor deposition Method is based on the use of gas-discharge plasma energy to initiate a chemical reaction of precursor gases to active radicals, ions and excitated particles that react chemically on wafer surfaces to form a thin film. SemiTEq system design ensure precise control of refractive index, buffer oxide etch rate, mechanical tension in thin films obtained during deposition process.Optimized gas supply system allows to achieve excellent thickness uniformity and refractive index of deposited films.
