By AMT&C Group (Advanced Magnetic Technologies & Consulting Group)
Physical vapor deposition (PVD), realized by target cathode sputtering in magnetron discharge plazma Magnetron sputtering is used for producing thin films. High plasma density at target surface and material sputtering rate achieve due to perpendicular action of electric and magnetic fields. SemiTEq reactor of special design allows to adjust distance from target to wafer, as well as magnetron sources with a scanning magnetic field provide versatile process control, high coating uniformity and low consumption of sputtering material.
