By American Precision Dicing, Inc.
APD provides semiconductor die pick and place services for customers who need singulated die transferred from dicing tape into waffle packs, gel packs, trays, tape and ring, film frames, or customer-specified carriers. Unlike SMT pick and place for PCB assembly, our work focuses on post-dicing die handling, die sorting, inspection, placement, labeling, and packaging for semiconductor and advanced materials projects. After wafer dicing, careful handling of singulated die is critical. While many customers request their cut wafers remain on the dicing tape, American Precision Dicing (APD) offers post-dicing support for customers who require individual die extraction, sorting, inspection, placement, labeling, and custom packaging. Flexible Workflows: Manual, Semi-Automatic, & Automated Die Handling - Because no two projects are identical, APD does not force every job into a single process. Depending on the customer's specific requirements, including die size, material sensitivity, volume, and lead time, APD supports manual, semi-automatic, and automated die handling workflows when appropriate for the project. This flexibility allows us to match the handling method to the project, whether that involves custom, low-volume engineering runs requiring delicate manual extraction, or highly repeatable production batches where semi-automatic or automated handling provides the best efficiency. Die Picking & Inspection - Die picking involves removing the singulated die from the holding medium. APD is equipped to extract die from standard dicing tape, UV release dicing tape, and Van der Waals dicing tape. During the picking process, our team can perform visual inspections of the individual die pieces. We actively screen for customer-defined criteria, including: Chips and cracks; Cut placement accuracy; Peeling of gold or metals from the backside; Sidewall fracturing; Custom inspection requests tailored to your project. Die Placing & Packaging Media - Once die pieces are sorted, picked, and inspected, they must be safely transferred into a carrier for shipping or further processing. APD supports standard and highly customized placement requests, including specific sequencing, lot separation, and special orientation requirements. We can place singulated die into a variety of handling media, including: Waffle packs; Gel packs; Vacuum-release gel packs; Trays; Tape and ring / Film frames; Customer-supplied custom containers. What is semiconductor die pick and place? Semiconductor die pick and place is the process of transferring singulated die from dicing tape or another carrier into specified packaging media such as waffle packs, gel packs, trays, or film frames. Does APD offer pick and place for PCB assembly? APD is not an SMT assembly house. Our pick and place services focus on semiconductor die, diced wafers, singulated substrates, and post-dicing handling. For FR4 and PCB-related work, APD may support dicing, cutting, or depaneling requirements depending on the material and project scope. What information is needed for a pick and place quote? Please provide die size, wafer or substrate material, wafer size, wafer or die quantity, incoming carrier, outgoing media, orientation requirements, inspection criteria, labeling needs, and timeline.
