The electronic-photonic interposer is an extension of our active PIC technology. Here, the photonics wafer is flipped and bonded to a handle wafer before additional processing for electronic and photonics I/O. After flipping, the interposer can be used to create trenches for laser chips to be soldered in. Alternatively, waveguides can be selectively exposed for heterogeneous integration of exotic materials, or the terminal metal can be bumped for flip chip of CMOS driver chips. We utilize advanced waveguide fabrication methods that improve silicon waveguide propagation loss to < 0.5 dB/cm while the silicon nitride waveguide propagation loss is < 0.35 dB/cm. Design Information The electronic-photonic interposer PDK is scheduled to be released in Q4/2023. The electronic-photonic interposer is supported by the component library from Analog Photonics (APSUNY). The APSUNY library is a comprehensive, high-performance, black box library focused on operation in the O, C, and L bands.
