We provide advanced wafer-level and die-level assembly and packaging services for both AIM Photonics’ multi-project wafers as well as customer-provided wafers and chips. Capabilities include: - Fiber Attach - single mode fiber, fiber arrays, PM fiber and active alignment - Flip Chip (photonic and electronic) - thermal, sonic and compression and placement within 0.5 µm tolerance - Wafer Probing - optical/RF/DC - Dicing - standard thickness wafers 775 µm, thin wafers ~100 µm, dicing street ≥ 100 µm mechanical and ~10-15 µm plasma and laser - Die Attach - conductive and/or non-conductive adhesives - Wire Bonding - ~100 µm pitch with 1 mil wire and ~150 µm pitch with 2 mil wire - Metallization - plating: Cu, SnAg, Pd, Ni, Au and sputtering: Ti, TiW, Cu, NiV, Ni - Bumping - depending on aspect ratio, >75 µm pitch; <75 µm is on the roadmap - Heterogeneous Integration - Electronic Photonic Interposers - Silicon chip carriers and full interposers with TSVs - Wafer-to-Wafer Bonding - Oxide fusion bonding, hybrid bonding, temporary bonding
